Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Examination and Comparison of Pb-free Thick Film Products for Automotive Applications|
|Keywords: Lead Free, Thick Film, Reliability|
|Lead (Pb) containing thick film pastes are well established in terms of robustness, reliability and functionality in automotive applications for more than 20 years. Due to changes in environmental regulations and overall shift to “green” manufacturing principles, the industry is migrating to lead free (Pb-free) material systems. This presentation will compare and review Pb containing to Pb-free materials with regards to standard properties and long term reliability – including high temperature storage at 150 °C and 175 °C for up to 1000 hrs, accelerated life testing, such as thermal shock and environmental testing under 85 % Rh at 85 °C. The review will include materials for conductors, resistors, overglazes and solutions for electroless plating. The tests are conducted on alumina substrates with and without a multilayer dielectric. The study also examines performance of both substrates when protected by high temperature (850 °C) and low temperature (600 °C) overglazes. Wire bond results for both gold (Au) and aluminum (Al) bonding wire will be shown on an electroless plateable silver conductor material. Key words: Lead free, Conductors, Resistors, Overglazes, Electroless Plating, Reliability|
|Mark Challingsworth, Technology Manager
Heraeus Precious Metals North America Conshohocken, LLC
West Conshohocken, PA