Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|LightForm - Laminated LED Lighting|
|Keywords: LED, Lamination, Lighting|
|LightFormTM is a new method to package “inorganic” Light Emitting Diode (LED) chips. The new process removes many steps now required in the packaging of LED’s. The process enables high throughput manufacturing, but with less equipment and floor space than that currently used in LED packaging. The concept also eliminates the primary failure mode within a packaged LED, the wire bond. The technology places each LED on a conductor and a transparent conductor is roll laminated over the top of the LED. Lamination is a high volume, high speed process, in the field of printing and packaging, not typical in lighting and electronics. Because it’s a film, this new lighting product can conform to the shape and contours of virtually surface. The LightForm technology creates a low profile LED lamp that does not require a traditional bezel or lens that would add weight and thickness. It can be mounted with an adhesive backing to nearly any surface material, so it does not need mounting fasteners that require holes to be drilled in interior surfaces. These features gives Grote’s new LightForm Emergency Egress Lighting Film all of the advantages of adhesive exit markers with the added benefit of LED illumination. For the last few years, Grote Industries has developed the technology through custom equipment fabrication, material characterization and design of experiments. The technology is not typical of LED or electronic manufacturing. There are no wire bonds, lead frames, optical epoxy, solder, or resistors. These components are replaced with rolls of clear plastic, copper and adhesive. The presentation will provide a background, the status and the potential of this new technology.|
|Tim Brooks, Chief Engineer