Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Leveraging Solderless Press-Fit Interconnects in Automotive Micro Electronic Power Modules and Power Applications to Improve Assembly Efficiency and Design Flexibility|
|Keywords: press-fit pins, power modules, high current|
|Press-fit components have already been qualified for a range of automotive applications across the full spectrum of operating conditions, from under-hood, engine-mounted deployments to inside the passenger cab. As the industry continues to evolve, to support the ongoing electrification of automotive systems, the convergence of microelectronics and power require solutions that are efficient to manufacture and provide interconnect solutions that are solder-free. Applications such as regenerative braking, electrical-assisted braking, power-pumps and servo-driven steering assistance are just a few examples of areas where solder-free, press-fit interconnect technology that can support high current are needed. The need for sustained reliability across a broad range of operating temperatures and environmental conditions requires interconnects in automotive applications to meet very rigorous specifications. Conventional solder connections add risk as a point-of-failure because repeated stresses from CTE mismatches eventually cause cracks or breakage at the solder joint, whereas press-fit’s spring-like design flexes to maintain a consistent interface throughout thousands of temperature cycles. As complex control circuits are combined with larger power components, designing for thermal dissipation and CTE mismatches often presents significant challenges. New press-fit compliant pins with higher current capacity can make final assembly easier and improve reliability. Press-fit interfaces have been proven to support current capacities of 30 amps or more through a single press-fit eye and tested to maintain reliable, predicable current carrying performance curves across a range of temperatures including 125ºC to 150ºC and above. This presentation will address key factors for leveraging press-fit within automotive microelectronics and power modules, including: • Various methods of terminating off of power based components mounted on DBC thermal substrates • Providing strain-relief between internal modules/PCBs • Integrating press-fit interconnects through external housings • Capability of press-fit to carry higher power and the various alloy choices that support automotive applications|
Interplex Engineered Products (IEP)
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