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Development of New Adhesion Test Methodology for Harsh Environment Microelectronics Applications
Keywords: Adhesion, Die shear, Harsh environment
As the electronics industry evolves into more and more demanding application requirements, the need for improved characterization techniques becomes even more critical. This paper describes the development of a new technique to characterize adhesion strength for some of the harsh environment conditions that are becoming common in today’s world. This test method involves utilizing some of the standard industry testing infrastructure, but with some critical changes to optimize several aspects of the testing protocols for these types of applications. This includes guidelines for substrate selection, sample preparation, testing parameter ranges, test result interpretation, and the supporting data to demonstrate how it applies for some types of harsh environment testing.
Lyndon Larson, Senior Application Engineer
Dow Corning
Auburn, mi
USA


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