Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Integrated Passive Devices into silicon for new automotive challenges|
|Keywords: passives integration, wafer level packaging, silicon interposer|
|Facing to gasoline ever higher price, automotive copes with new challenges like engine down-sizing or electrical cars. These technologies are looking for more electronics compliant with higher reliability and performances in harsh environment and offering better integration. Sensors, actuators and calculators on engines, gearboxes, brakes or exhaust are particularly looking for improvement of electronics integration and compliancy with operating temperatures higher than 150°C. Another challenge is to restrain global power consumption. The characteristics of this integrated passive silicon technology (low leakage current, high stability, low ageing and compliancy with operating high temperature) are completely dedicated to improve automotive systems performances. Due to their close integration to active components and innovative assembly technology, passive devices “on silicon die” offer drastic improvements for signal integrity and space savings compared to the commonly used SMD components. They are the solution to reduce application volume and increase IP protection level. With an ever increasing pressure on costs and system integration in today’s microelectronic industry, electronic automotive solutions are demanding a higher complexity in die and package designs. With its passive integration solution onto silicon used as interposer platform for 2D and 2.5D combining stacking, flip chip and bumping technologies, IPDiA is offering new ways to cope with cost and technical constraints for new automotive applications. While standard SMD components may remain the preferred ones for many automotive electronics, face-down direct chip attachment is proposing a new design way. More than interacting on electrical functionalities, the WLCSP is catching on mechanical and thermo mechanical properties with higher miniaturization and a direct transfer on PCB without additional packaging steps. In addition, IPD technology offers flexible finishing solutions in line with the embedded technologies, such as copper based ones or flip-chip internal interposers. Of course these solutions cope with constraints of PCB and flex supports, as well as last innovative micro-plastics objects with cavities.|
|Guillaume Raimbault, Business Development Manager