Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aluminum Inlay Design Requirements for Automotive Electronics Leadframes|
|Keywords: Aluminum, Inlay, Leadframe|
|This paper will discuss the key design concerns when implementing Aluminum Inlay leadframes for automotive electronic leadframes that will be wire or ribbon bonded. It will cover the mechanical properties and dimensions of the aluminum as well as the base metal options. Temperature testing of this Aluminum Inlay and the intermetallic layer in the range from -40 degrees Celsius up to 250 degrees Celsius will be addressed. Wire bond quality comparisons between Al Inlay and other surfaces will be reviewed and special focus will be between .005” to .010” wire diameters.|
|Mike McKeown, Power Electronics Sales Manager
Materion Technical Materials