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Aluminum Inlay Design Requirements for Automotive Electronics Leadframes
Keywords: Aluminum, Inlay, Leadframe
This paper will discuss the key design concerns when implementing Aluminum Inlay leadframes for automotive electronic leadframes that will be wire or ribbon bonded. It will cover the mechanical properties and dimensions of the aluminum as well as the base metal options. Temperature testing of this Aluminum Inlay and the intermetallic layer in the range from -40 degrees Celsius up to 250 degrees Celsius will be addressed. Wire bond quality comparisons between Al Inlay and other surfaces will be reviewed and special focus will be between .005” to .010” wire diameters.
Mike McKeown, Power Electronics Sales Manager
Materion Technical Materials
Mineola, NY
USA


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