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Low Pressure Molding
Keywords: molding, low pressure, LPM
Low pressure over-molding (LPO) is synonymous with Low Pressure Molding (LPM) and is the low cost alternative to traditional methods of protecting electronic assemblies, such as conformal coating and potting. With LPO, manufacturers electronic circuits of are not only able to make their assemblies water, shock and vibration proof; they are able to make the assemblies resistant chemicals as well. Another advantage of using LPO is the ability to eliminate separate housings, and the mechanical fasteners that would normally hold the PCB to the housing as the over-mold also acts as the product enclosure. one of the two parts of the material typically used in potting housing lids and the cure process associate with both conformal coating and potting. Lengthy cycle times associated with potting and conformal coating processes are typically reduced to 1-2 minutes with LPO. Another key advantage is that the elimination of the associated utilities, required to cure the potting results in a process that is more environmentally friendly. Two or three case studies will be presented to better demonstrate the process and how it was used to resolve specific problems in the design and manufacture of the products in question
Lawrence Butts, Sr. Engineer - Mechatronics Development
BGM Engineering, Inc.
Shelby Twp., MI

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic