Micross

Abstract Preview

Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

IGBT’s from the Top Down; Electrical & Thermal Connectivity from Die Attach to Heat Sink
Keywords: IGBT, Thermal, Reliability
Take a serious look around into any new concepts in efficient people movers, and you’ll see electric motors. Whether you are looking at hybrid, motor-generator, GenSet (Generator Set) propulsion, and mass transit or long distance vehicles, at some point in the movement process, an electric motor is providing movement. Driving each of these electric motors is an Insulated Gate Bipolar Transistor (IGBT) module. Back in the early 20th Century, direct induction, bipolar electric motors were introduced on locomotives as the first step forward into efficient transportation. Fast forward one hundred years, and the modern equivalents, IGBT controlled devices are controlling similar type electric motors for moving people in all shapes and sizes, from elevators to subways to automobiles. In this presentation, we will discuss the way solders perform in the stack up, from die attach to heat sink, focusing on thermal transfer value and reliability data.
Mario Scalzo, Sr. Technical Support Engineer
Indium Corporation
Clinton, New York
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems