Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Plastics for MEMS and Sensors in automotive|
|Keywords: Sensors, mems, plastic|
|More than 50% of all new innovations in automotive are done in electronics. Sensors in general and MEMS in specific are key components to various automotive interfaces managing internal and external controls. The extreme performance requirements of the automotive industry pose a significant challenge to the choice of proper high performance plastics used in the packaging of these components. In this paper, we will for the first time ever present benchmark studies of incumbent material systems such as PPS, PPA or LCP versus a new material class PA4T. In specific we will discuss Laser Direct Structuring as an attractive technology to not only realize a sensor but moreover integrate the entire PCB and driving circuitry straight into the sensor. We also present a case study on the impact of the package material on warpage and delamination in MEMS as two main reliability sources which will also have a direct impact on total system cost.|
|Dr. Tamim Peter Sidiki , Global Marketing Manager
DSM Engineering Plastics B.V.