Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Cycle Resistant Lead Free Alloys|
|Keywords: Lead Free Solder, Alloy, Reliability|
|As the majority of electronics manufacturers have moved to Pb-free alloy compositions, the transportation and infrastructure fields have been hesitant due to potential reliability limitations to the status quo|
|Derek Daily, GM, Advanced Technology
Senju Comtek Corp