Here is the abstract you requested from the Automotive_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|KEYNOTE: Qualification of Semiconductor and Passive Device Packages to Automotive Environments|
|Keywords: Semiconductor, Passive, Device Packages|
|The Automotive Electronics Council was formed in 1994 to foster cooperation between semiconductor device (Tier 2) manufacturers and (Tier 1) users in developing mutually acceptable qualification test requirements. While most die-level wearout reliability fail mechanisms can be addressed via highly stressed tests that take a small population to failure, the same cannot generally be done for package-level fail mechanisms. Because the materials used to connect and protect the die are susceptible to damage at lower temperatures, reliability stress tests are designed with a much lower acceleration factor. Because of this, package-level fail mechanisms cannot be stressed to failure for all but a few parts, forcing us to test larger sample sizes and setting fail criteria. These tests are done on product die. Efforts have been made to design test die that will detect package-level fail mechanisms with uncertain success. I will discuss the suite of tests we currently have that address package-level fail mechanisms and how new materials and packages need to be addressed for qualification.|
|Bob Knoell, Quality Manager - Americas
NXP Semiconductors and AEC Coordinator
Farmington Hills, MI