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Silicon Nitride Substrates for Power Electronics
Keywords: Silicon Nitride, Substrates, Power Electronics
The demand for increased power density, higher chip temperatures, longer cycle life, and higher operating temperatures for power electronic systems will require new substrate tech-nologies and materials. State of the art power electronic modules based on alumina and al-uminium nitride ceramic will soon be unable to meet the demands of new applications like HEV/EV or offshore wind turbines, thus requiring new insulating materials and substrate technologies. The excellent bending strength, high fracture toughness and good thermal conductivity of Si3N4 makes it well suited for power electronic substrates. In this paper we will compare vari-ous substrate technologies including the latest developments in silicon nitride substrates. The paper will discuss the characteristics of the ceramic and a detailed comparison of key values like bending strength and fracture toughness on final substrate behaviour and reliability.
Manfred Goetz, Product Manager
curamik electronics GmbH
Eschenbach, D
Germany


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