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Laser Processing and Integration for Si Interposers and 3D Packaging Applications
Keywords: TSV, Interposer, Laser
Presented here are laser processes for drilling debris-free and recast-free vias in silicon that are then integrated into downstream process. The process strategy consists of an integrated laser via drill system combined with an isotropic etch. By careful selection of both the laser and etch process parameters it is possible to control the via depth, diameter, sidewall slope/taper, and to eliminate the damaged Si material in the laser heat affected zone. Because the etch process is selective to Si, this is a mask-free and cost-effective process. Two different processes are demonstrated. For Part 1 we demonstrate an integrated process flow for TSVs with diameters in the range of 250 um for <500 um thick Si wafers and a dry etch process. For Part 2 we demonstrate with a wet etch process
Matthew Knowles, Ph.D., Product Marketing Manager
Electro Scientific Industries, Inc.
Portland, OR

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