Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Assembly Challenges for Large 2.5D TSV Products|
|Keywords: Assembly, 2.5D TSV, Interposer|
|Interposers provide a crucial intermediate step for next generation products to allow side-by-side integration of technology optimized devices ahead of a full 3D assembly. The interposer size in most cases is greater than 22mm on a side and in some designs exceeds 30mm. This large size combined with a thickness of ≤ 100 microns may result in high warpage which can significantly impact the assembly process. Materials and process selection become a key consideration to create a high yielding, multi-die stacked product. This presentation will outline the challenges of a large 2.5D TSV product and how assembly strategies can be used to accommodate these challenges. Different process options and die attach sequences for interposer to substrate and chips to interposer will be discussed. The assembly methods for attaching multiple die with tens of thousands of I/O at 40 micron fine pitch will be compared in relation to the die size and interposer warpage. Product design requirements may also dictate that the optimum assembly approach is achieved by combining methods such as mass reflow and TCNCP bonding for die attach and underfill. Test considerations at intermediate assembly steps will also be reviewed for feasibility in the overall process flow.|
|Marnie Mattei, Sr. Director, TSV Product Development
Amkor Technology, Inc.