Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die|
|Keywords: 3D integration, Flip Chip Bonding, Chip to Wafer|
|Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10µm micro-bumps at 20µm pitch|
|Gilbert Lecarpentier, Product Manager
Saint Jeoire, Haute Savoie