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Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die
Keywords: 3D integration, Flip Chip Bonding, Chip to Wafer
Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10µm micro-bumps at 20µm pitch
Gilbert Lecarpentier, Product Manager
Saint Jeoire, Haute Savoie

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