Micross

Abstract Preview

Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Market Demand and Readiness for 2.5 / 3D TSV Products
Keywords: TSV, Market, Applications
The market has narrowed its approach and solidified its direction for the majority of 2.5 and 3D TSV product technologies. Forecasts have now become real for these technologies and the end game realized as evidenced by production launch of the Xilinx Virtex-7. This talk will discuss market trends, anticipated product launch dates as well as general capacity needs as the market begins to rollout these new products.
Ron Huemoeller, Sr.VP, Advanced 3DIC
Amkor Technology
Chandler, AZ
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems