Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Calibration of Silicon MEMS Gyroscopes|
|Keywords: gyroscope, calibration, quality factor|
|We report our progress on the development of thermal calibration and stabilization for high-Q silicon MEMS gyroscopes. Most MEMS gyroscopes and resonators are sensitive to environmental fluctuations and require temperature compensation. While high precision quartz and silicon MEMS resonators have advanced in thermal stabilization technologies, the work on stabilization of silicon MEMS gyroscopes is ongoing. Our approach covers both design and packaging levels of high-Q MEMS transducers. Similar to high stability dual-mode resonators, we utilized the drive-mode frequency for a temperature self-compensation of a gyroscope sense-mode drifts. Owing to 1 million Q-factor of the vacuum packaged MEMS quadruple mass gyroscope, we achieved a milli-celcius resolution, suggesting feasibility of precision thermal calibration for long-term stability. In addition, we pursued an anchor loss minimization to reduce stresses from thermal coefficient mismatches between silicon and a ceramic package. The reduced die attachment radius is expected to improve temperature coefficient of the frequency and reduce bias and scale factor sensitivities. These efforts effectively allowed to reach a sub-degree per hour bias instability of the vacuum sealed quadruple mass gyroscope, providing a path for inertial-grade MEMS gyroscopes.|
|Igor P. Prikhodko, Graduate Student Researcher
University of California, Irvine