Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New Advances in 3D/2.5D Integration|
|Keywords: Memory, Interposer, 3D|
|It is widely agreed that memory is the low hanging fruit of 2.5/3D integration. It demonstrates the advantages of bringing togther semiconductor processees and technologies that are difficult to cost effectively combine in an SOC. The presentation will describe the latest efforts to combine large memories with logic elements using interposers as well as a more full 3D stacking approach. Discussion of devices recently made and those in progress will include results and lessons learned.|
|Robert Patti, CTO
Tezzaron Semiconductor Corp.