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Molded Underfill for CSP Applications
Keywords: molded underfill, flip chip processing, C4
Flip chip interconnect has been around for many years as a reliable, high volume alternative for the fabrication of high performance ICs. To achieve this connection reliably, the use of an encapusulant that can absorb the thermo mechanical stress created by the large difference in coefficients of thermal expansion between Silicon and plastic laminates. For the longer part of the history of flip chip, liquid underfills that flow driven by capillary force have been used. This process is slow and requires additional overmold processing; therefore the potential for cost reduction and process improvements exists. We present a overview of the development challenges and successes of converting regular capillary underfill products to a single molded underfill process with emphasis in the needs for improved package design, material formulation and process improvements. We showed that MUF is a highly reliable, repeatable process, with great promises for cost reduction through process and material consolidation. Some trade-offs remain in terms of design for manufacturability and tailored development ramps.
Fernando Roa, Director CSP, SIP, Hybrid Packaging
Amkor Technology Inc.
Chandler, AZ

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