Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Low-Cost Adhesives for Temporary Substrate Support|
|Keywords: Thin, Adhesive, COO|
|Temporary adhesives are a key part to 3DIC integration. Choosing the right adhesive is critical as it defines your process, tooling needs, and by virtue of its chemistry, will control throughput and yield. Although several products and tooling exist in the market, few offer a clear path to achieve HVM at an affordable cost. A wide range in materials and processes are available, most which can be tailored to a specific design or tooling objective. Multiple options in adhesives allow grinding and polishing to <20um, protection during backside processing (e.g. TSVs), thermal resistance to >400C, CVD acceptance (Fig. 1), and rapid removal with cleans on a film frame (Fig. 2). Using batch processing, throughput is increased by a factor of 5 while cost is reduced by 50%, suggesting a COO that is 10% relative to current practice. Instituting simple materials and processes matched to a customer's design will provide benefits beyond cost savings, including “green factory” certification. This presentation reviews several current practices in the market and contrasts these options with alternative low-cost adhesives and processes that are tuned to a customer's product design and tooling. Examples include excerpts from handling thin substrates in semiconductor, solar, and TFT/LCD fabrication lines.|
|John Moore, President