Micross

Abstract Preview

Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Reliability for LED Lighting Design
Keywords: Thermal management, substrate, packaging
Light output and quality of light will degrade over the lifetime of an LED assembly. Several failure mechanisms will determine the mode, rate and extent of degradation. Temperature exposure and temperature induced mechanical stresses are major culprits behind performance degradation. We will explain the physical-chemical nature of these mechanisms. In addition we will address tools to assess and model the robustness of a thermal design. Finally, we will highlight various solutions that will mitigate thermal degradation.
Justin Kolbe, Sr. R&D Engineer
The Bergquist Company
Chanhassen , MN
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems