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Thermal Reliability for LED Lighting Design
Keywords: Thermal management, substrate, packaging
Light output and quality of light will degrade over the lifetime of an LED assembly. Several failure mechanisms will determine the mode, rate and extent of degradation. Temperature exposure and temperature induced mechanical stresses are major culprits behind performance degradation. We will explain the physical-chemical nature of these mechanisms. In addition we will address tools to assess and model the robustness of a thermal design. Finally, we will highlight various solutions that will mitigate thermal degradation.
Justin Kolbe, Sr. R&D Engineer
The Bergquist Company
Chanhassen , MN

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