Micross

Abstract Preview

Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Rigid and Flex PCB Based Microsystems for Mobility, Systems Development and Harsh Environments
Keywords: systems, mobility, PCBMEMS
The exploration of PCBMEMS as a path towards systems development continues. PCBMEMS technology based on rigid-flexible laminates is desirable for miniaturization and integration of systems for mobility and harsh environment deployments. The technology provides substantial flexibility in systems design and integration of multiple functions into limited spaces. Using this design and construction approach allows lightweight, complex, and space efficient systems. Flex microsystems based on structurable, non-fiber filled laminates permits miniaturization to occur at two levels: at the micro scale with the embedding of microstructures in the substrate, and at the macro scale with the ability to flex the system across millimeter to centimeter lengths of real everyday systems. Examples will be given where the technology is being applied toward several different systems including mobile chemical analyzers, heat and mass transfer devices, portable therapeutics, augmented mobile phone systems, and high density microfluidics-based robotics.
David Fries, Director of EcoSystems Technology Group
University of South Florida
St. Petersburg, FL
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems