Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aerosol Jet® Printing of a Silver-Epoxy Conductive Adhesive for High Density Applications|
|Keywords: Aerosol Jet, conductive epoxy, die attach|
|Silver -filled epoxy adhesives are widely used for die and component attach using conventional dispense valves in virtual contact with the substrate. With the ongoing need to bond smaller contact areas, these traditional materials and processes are challenged to reliably meet the new requirements. This presentation will report on a new Aerosol Jet® system that creates very fine features without contacting the substrate and a new nanosilver epoxy adhesive specifically designed for use with the Aerosol Jet system. With this combination of novel material and dispense technology, adhesive contact features less than 30 µm can be produced in recesses up to 1 cm deep using a jetting process that requires no mechanical contact to the substrate. Adhesive deposition on multiple levels of a substrate (3D) is readily accomplished. This presentation will cover the electrical, mechanical, and thermal properties of the new adhesive and the dispensed patterns that can be created with the Aerosol Jet system. Initial results on bonded components will also be presented.|
|Kurt K. Christenson, Senior Scientist
St. Paul, MN