Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|System Scaling Superhighway|
|Keywords: Semiconductor, Smart mobile devices, IC to PCB|
|There is semiconductor paradigm shift from chip-scaling to system-scaling happening now to meet the ever increasing demand in system form factor, density, performance and reliability. This shift is also triggered by fast growing market demand for smart mobile devices and the concerns of Moore’s Law sustainability. Cu has unique properties of high thermal and electrical conductance, with excellent electrical and thermo-mechanical reliability. It plays key role in interconnect and packaging technology, which enables the system-scaling. Cu interconnect is the superhighway from IC to PCB. The system-scaling integration flow is new to industry. In addition to these conventional CPI (chip-package-interaction) issues, new and more complex issues associated with CSI (chip-system-interaction) are here for us to address more carefully. Speaker Bio: Dr. Douglas C.H. Yu is a Senior Director of Integrated Interconnect and Package Technology Division in TSMC R&D. He is involved in the development of advanced Module technologies and Shrink technology. He was responsible for the development of TSMC interconnects technology for more than 9 generations. Doug established the first Cu/Low-K lab for Foundry and led Si industry to change interconnects from Al/SiO2 to Cu/Low-k at 0.13m-node, which became industry standard at 65nm-node. Later, more advanced Cu/ULK and Low-R/ULK were delivered at 40nm and 28nm nodes, respectively. On assembly, Doug built the first TSMC R&D line and delivered a disruptive bump-on-trace technology that is the first advanced assembly technology offered by the foundry. He is also in charge of the development of Through-Si-Via technology in addition to other key advanced assembly technologies. Doug served as general co-chairs of IEEE IITC and chaired ITRS Interconnect conferences. He serves as an advisory board member of IEEE IMPACT and Industrial Advisory Board member of Microsystems Industrial Group at Microsystems Technology Laboratories/MIT. He earned Ph.D. degree on Material Science and Technology from Georgia Institute of Technology. He holds 280 US patents with numerous publications on semiconductor technologies.|
|Dr. Doug C.H. Yu, Senior Director
TSMC R&D, Integrated Interconnect and Package Div.