Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies|
|Keywords: Next Generation Package, Interconnect Technologies, IC Package|
|There are several application and device trends driving IC package development today. Among the most prevalent are: - Form factor reduction for handheld devices - Increased functionality requiring higher bandwidth - Higher power dissipation - Higher operating frequencies resulting in reduced electrical noise margins - Increased use of sensors - Full conversion to green material sets - Silicon node progression. These trends occur concurrently in many applications, which often results in conflicting requirements. In addition, the market continues to apply relentless pricing pressure on the supply chain. Hence, simple, cost-effective solutions are mandatory. This presentation will highlight packaging technology developments that address the device and application trends listed above. Several innovative packaging platforms will be discussed: - Copper pillar CSP and BGA - Through Mold Via Package on Package (TMV® PoP) - Flip Chip Molded BGA (FCMBGA) - Wafer Level CSP - Through Silicon Via CSP and BGA. In each case a clear value proposition will be presented, along with key supporting data. It is truly an exciting time to be part of the industry solving complex packaging and interconnect challenges. Speaker Bio: Dr. Robert Darveaux is Corporate Technology Officer at Amkor Technology. Robert has 24 years experience in the IC packaging field at the Microelectronics Center of North Carolina, Motorola, and Amkor. Robert has a B.S. in Nuclear Engineering from Iowa State University and a Ph.D. in Materials Science and Engineering from North Carolina State University. His areas of expertise in IC packaging include thermal and mechanical simulation, materials characterization, failure analysis, and fatigue life prediction for solder joints. Robert has published over 75 technical papers and has 22 patents.|
|Dr. Robert Darveaux, Senior Vice President of Technology & Platform Development
Amkor Technology Inc.