Here is the abstract you requested from the DPC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Use of Stepper Through-Silicon Alignment System to Evaluate Bonded Wafer Distortion|
|Keywords: Through-Silicon Alignment (TSA) , Infrared Metrology , Bonded-Wafer|
|This paper examines the use of a Canon Stepper to compensate for distortion of wafer shot-grid layout that can be experienced by bonded and thinned wafer pairs. Evaluation results were gathered using Canon i-line steppers that are designed to support advanced packaging and chip stacking applications. Canon will introduce the Through-Silicon Alignment (TSA) System that uses stepper's internal infrared metrology system to measure front-side and back-side alignment targets within a bonded-wafer stack. Grid distortion characterization and overlay correction options provided by the stepper will also be reviewed.|
|Doug Shelton, Product Marketing Manager
Canon USA Inc.
San Jose , CA