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Use of Stepper Through-Silicon Alignment System to Evaluate Bonded Wafer Distortion
Keywords: Through-Silicon Alignment (TSA) , Infrared Metrology , Bonded-Wafer
This paper examines the use of a Canon Stepper to compensate for distortion of wafer shot-grid layout that can be experienced by bonded and thinned wafer pairs. Evaluation results were gathered using Canon i-line steppers that are designed to support advanced packaging and chip stacking applications. Canon will introduce the Through-Silicon Alignment (TSA) System that uses stepper's internal infrared metrology system to measure front-side and back-side alignment targets within a bonded-wafer stack. Grid distortion characterization and overlay correction options provided by the stepper will also be reviewed.
Doug Shelton, Product Marketing Manager
Canon USA Inc.
San Jose , CA

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