Micross

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Characterization and Reliability of Custom Digital ASIC Designs using a 0.8µm Bulk CMOS Process for High Temperature Applications
Keywords: digital ASIC, high temperature, reliability
With today's quickly changing technology, part obsolescence often forces unanticipated and costly design changes outside the normal product life cycle. Custom ASICS can be used to fill this gap and gain other advantages such as reduced parts count, higher performance, and higher reliability. Two digital 0.8µm bulk CMOS ASICS have been successfully implemented providing higher reliability and performance than their replacement parts at 225ºC. In this paper we examine some of the design issues encountered during their implementation, including process selection, library characterization at 225ºC and above, performance, testing and qualification. External analog circuitry was integrated to further reduce parts count and increase reliability. In conclusion we have found bulk CMOS to be an acceptable process for custom ASICS in high temperature environments.
Mark Watts, Senior Design Engineer
Quartzdyne Inc.
Salt Lake City, Utah
USA


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