Device Packaging 2019

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An Ultra-Low Noise Instrumentation Amplifier Designed for High Temperature Environments
Keywords: high temperature, integrated circuit, amplifier
In many industries, there is growing demand for electronics that can operate reliably in harsh environments, including extremely high temperatures. This presents challenges that affect many aspects of the electronics system, including the silicon, packaging, qualification methodology and reliability. One device that requires high precision in elevated temperature data acquisition applications is the instrumentation amplifier, which is used to amplify very weak signals in noisy environments. This specialty type of precision amplifier is generally the first component of the measurement front-end, and its performance is critical for the entire signal chain. This paper presents an ultra-low noise instrumentation amplifier designed specifically for high temperature applications. The device uses a proprietary silicon-on-insulator process that minimizes parasitic leakage currents at elevated temperature. Variance in device parameters are managed to maintain high performance over a wide temperature range. Layout and packaging considerations that would affect long term reliability are addressed. The amplifier is well characterized above 200C and attains much higher performance than amplifiers not optimized for high temperature operation. Operating life tests for over 2000 hours have been completed to date to ensure high reliability.
Jeff Watson, Systems Applications Engineer
Analog Devices
Stevens, PA

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