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SLID Bonding for Energy Dense Applications - Thermo-Mechanics
Keywords: Advanced packaging materials, SiC power transistor, High power and temperature
Solid-Liquid Inter-Diffusion (SLID) bonding is traditionally a technology used for high performance and high reliable die attach/interconnect applications [1]. The generic properties of SLID allows the bonding to occur at a relatively low process temperature. However, when the bond is completed, the final joint has a melting temperature well above the process temperature. This makes it well suited as for high performance electronic assemblies. The typical bonding temperature of Cu-Sn SLID and Au-Sn SLID are 280-300 °C and 320-350 °C respectively. These temperatures compare to that of other high temperature (HT) electronic adhesives e.g. Staystik® 101G. The thermal performance of the SLID bond is superior to other electronic interface materials. This is due to the thin joint (~ 10 µm) and the high thermal conductivity (~ 60 W/mK for Au-Sn). Thus, the thermal resistance of a SLID joint, about 0.2 mm2K/W, is significantly lower than most other joints suitable for use in electronic assemblies. SLID joints have also proven to be mechanically robust for harsh environment applications [1]. In this study the thermo-mechanical properties of SLID bonding are investigated. Simulations are performed to explore the stationary thermo-mechanical performance of SLID. Finite element analysis (FEA) is used to perform the simulations. The study is based on a case study involving a HT (> 200 °C) power controller device for a brushless DC motor for downhole applications. The results demonstrate the thermo-mechanical performance of SLID. A brief comparison to other state-of-art high performance and HT adhesives is also presented. [1] T.A. Tollefsen, A. Larsson, O.M. Løvvik, K. Aasmundtveit,
Andreas Larsson, Research Scientist
SINTEF
Oslo, -
Norway


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