Micross

Abstract Preview

Here is the abstract you requested from the HiTEC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Optimization of a Ceramic Circuit Board Clamp
Keywords: ceramic circuit boards, wireline, geothermal well logging
This paper documents the design optimization of a clamp for securing a ceramic circuit board to the electronics chassis in a wireline tool for operation up to 300°C+. This clamp fixes the extreme lower end of the ceramic circuit board to a common aluminum chassis while allowing the board and chassis to undergo differential thermal expansion. After developing equations that describe the stress, deflection, and thermal expansion of the clamp/board assembly, this report discusses the use of these equations to select the geometry and material options available in the design.
Dave Glowka, Owner
Red Rock Research, Inc.
Red Rock, TX
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems