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Evaluation of Thick Film Materials for Geothermal Applications
Keywords: Thick Film, HigH Temperature, Reliability
The paper will examine the behavior of thick film materials for use in packaging electronics for geothermal applications. The paper will focus on the conductor and dielectric adhesion as a function of 300oC storage with a dc bias voltage applied. Failure mechanisms will be explored.
R. Wayne Johnson, Professor
Auburn University
Auburn, AL

  • Amkor
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  • Technic