Here is the abstract you requested from the HiTEC_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Evaluation of Thick Film Materials for Geothermal Applications|
|Keywords: Thick Film, HigH Temperature, Reliability|
|The paper will examine the behavior of thick film materials for use in packaging electronics for geothermal applications. The paper will focus on the conductor and dielectric adhesion as a function of 300oC storage with a dc bias voltage applied. Failure mechanisms will be explored.|
|R. Wayne Johnson, Professor