Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Package Reliability Drop Shock and Temperature Cycling Testing Evolution, Challenges, and Trends|
|Keywords: Reliability, Drop Shock, Temperature Cycle|
|The increase in complexity of reliability testing over the past several years is in part driven by the increase in complexity of package architecture it is meant to evaluate. Movement from a pass/ fail centric suite of testing toward a trend of increased design for reliability and potential problem analysis driven testing criteria is evident. A facet of this is the increased emphasis on test to failure approaches for certain package related tests such as drop shock testing. Additionally, there is an increased importance on extracting more meaningful data from standard fixed duration tests such as temperature cycling. This paper will also examine the evolution of these reliability test techniques in parallel with the challenge of reliability test standards to keep pace.|
|Michael Ferrara, Staff Reliability Engineer
RF Micro Devices, Inc.