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Novel Ultra-Compact Quad-Band System-in-Package (SiP) Module with IC Embedded in Substrate Based on SESUB Technology
Keywords: embedded, SiP, SESUB
This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC is embedded inside the substrate and basics of SESUB technology are described. For electromagnetic compatibility and physical protection a metal EMI shield has been used. The total size of solution presented is 8.5x7.0x1.3mm³ demonstrating significant miniaturization over current module technology. The embedding process and SiP module routing has shown benefits in electrical and mechanical performance.
Volodymyr Sieroshtan,
EPCOS AG (TDK-EPC)
Munich, Bavaria
Germany


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