Micross

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Highly Flexible Die Attach Adhesives for MEMS Microphone Packages
Keywords: Adhesives, MEMS, Die Attach
Die attach materials for MEMS microphone packages must be highly flexible as temperature changes during the assembly process and application may lead to thermo-mechanical stress as a consequence of dissimilar thermal coefficients of expansion of substrate, chip and adhesive. Thermo-mechanical stress results in a distortion of the signal characteristics of the extremely stress-sensitive MEMS microphone packages. Within the scope of this paper, highly flexible heat-curing adhesives with a Young's modulus down to 5 MPa at room temperature (DMTA) were developed. DMTA measurements showed that temperature storage at 120 C did not cause the adhesive to embrittle, which would have a negative effect on the MEMS package's reliability. After storage at 120 C for 1,000 h, no increase of the Young's modulus was observed. The adhesives exhibit extremely low curing temperature of 80 C which reduces stress development during the assembly process. In addition, the adhesives have very process-friendly properties. Processing times of more than one week can be achieved. The option of dual curing enable preliminary light fixation of the chip within just seconds.
Dr. Tobias Koeniger, Product Manager
DELO Industrial Adhesives
Windach, Bavaria
Germany


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