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Use of 3D Packaging Technology for Satellite Active Antennas Front-ends
Keywords: 3D packaging, microwave, system-in-package
The increase in frequency of space telecommunications calls for a miniaturization of microwave modules that can be achieved through a System-in-Package (SiP) approach. In the case of future satellite antenna architectures with more than a hundred beams in Ka band (30 GHz), front-ends that fit within the array lattice are required to drive down the cost and the complexity of the antenna. The use of Multi-Chip Module Vertical (MCM-V) technology, or 3D packaging technology, allows the implementation of an orthogonal feeding of the radiating element resulting in a compact front-end module in Ka-band. In this paper the technological developments to get tolerances compatible with Ka band requirements at 30 GHz are detailed and the measurement results of an integrated feed module in radiation are given. Finally, the circuits designed to optimize the signal-to-noise ratio of the front-ends for receive antennas are characterized. The measured performances are as good as for an optimized planar front-end with waveguide access for a much more compact module, especially in terms of footprint in an antenna array. The prototype of integrated realized is a technology enabler for future architectures of Ka band satellite antennas.
Barbara Bonnet, RF packaging engineer
Thales Alenia Space
Toulouse, Midi-Pyrenees

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