Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Bonding Wire: Scalability, is it the Wave of the Future?|
|Keywords: Bonding Wire, Copper, Miniturization|
|Miniaturization is a major trend in the semiconductor industry today, and it necessitates that the entire ecosystem adapt and evolve. Current standard materials and tools make it possible to scale down to a certain level, but attempting to go beyond that leads to the figurative brick wall. Wire bonding infrastructure is so extensive that no other chip-interconnection method can displace wire bonds in the foreseeable future, although other technologies, particularly flip chip, will experience increasing utilization. Increasing miniaturization of electronic circuits has put relentless pressure on wire bonding technology to (1) increase yields (<25 ppm defects); (2) decrease pitch (<70 m for ball bonds) and (3) lowest possible and ever decreasing cost. Although there are efforts to make smaller wires, wire makers, wire drawing equipment and tool makers are working toward a boundary of existing methods. When wire diameter is successfully reduced, more issues correlated with wire uniformity and production control of the low required tension during the drawing process appear, these may result in low yield and higher cost. Another limiting point is the drawing die which experiences yield issue and high erosion at the very small diameter. Looking at the wire manufacturing process from a simplistic view, one could ask: How logical is it to cast the wire at a very large diameter, just to draw it down to a small diameter? This presentation will explore this question, and will discuss possible solutions for achieving miniaturization while avoiding the problems and expenses found with the current manufacturing process. Various wire bonding materials will be detailed, as well as the pros and cons of each. Attendees will learn about alternative materials, processes and technologies that could fundamentally improve the wire bonding infrastructure.|
|D. Stephan, Director, Application & Product Marketing
RED Micro Wire