Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Investigation of electrical performance and mechanical reliability of device embedded power module
Keywords: embedding technology, electrical performance, mechanical reliability
In recent years, improvements of electrical performances and miniaturization for mobile devices, as represented by smart-phones and tablet PCs have been making rapid progress. Following this trend, miniaturization and high conversion efficiency have been strongly demanded even for the power modules to be used these mobile devices. Device embedding technology has been used as one of the method to realizing miniaturization of the power supply system modules, commencing with the power module. And this technology is also expected to have improving of power source characteristics. We thoroughly examined and tested verification of miniaturization and technical advantages of power module at the design level, to research superiorities in electrical characteristics of power module built up with embedding technology. More specifically, we designed two comparative module models, one is built up with surface-mount technology and another is built up with embedding technology. We performed the electrical characterization of both designed models by clarifying the electric and the magnetic field coupling conditions on the output wiring net of the power module. In addition, time-domain voltage-waveform simulations are executed using the newly built model of the power device, in order to clarify the effect on the switching behavior of the power IC of these well"defined each electrical characteristic of modules. From the results of these studies, we have checked experimentally that embedded power module has advantages not only size reduction effect of 25% also noise reduction effect of about 50%.  In order to verify the results of this simulation study, we have developed an IC embedded module by using integrated process of power IC into the fabrication process of multilayer board. And from this study, embedded module has not only the feature of small size also improved power source characteristics. In addition, we checked experimentally that this developed module also has excellent mechanical reliability.
Masaya Tanaka,
Dai Nippon Printing
Fujimino-shi, Saitama
Japan


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems