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Through-silicon-via for silicon package
Keywords: TSV, Si package, 3D integration
In an ultimate integration packaging scheme, Si interposer will be soon directly reported on the PCB in a Direct-Chip-Attach (DCA) process, thus forming a
Yann LAMY, Projet leader / Senior scientist
CEA, LETI, Minatec campus
GRENOBLE, France
FRANCE


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