Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Through-silicon-via for silicon package|
|Keywords: TSV, Si package, 3D integration|
|In an ultimate integration packaging scheme, Si interposer will be soon directly reported on the PCB in a Direct-Chip-Attach (DCA) process, thus forming a|
|Yann LAMY, Projet leader / Senior scientist
CEA, LETI, Minatec campus