Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Investigation of Polyimide Based Coverlays on Handheld Device Antennas
Keywords: Microstrip Antennas, Coverlay materials, Antenna testing
Organic coverlays are required to protect microstrip circuits in most applications. The presence of coverlay can potentially influence the performance of microstrip antennas. This paper describes the qualification of polyimide based coverlays for microstrip antennas both in 900 MHz and 2.50 GHz frequency bands. An Inverted F-shaped antenna fabricated on FR-4 dielectric is used as the test vehicle and two different coverlay materials are tested with respect to key parameters like resonant frequency, S11 bandwidth, antenna gain, frequency detuning, and radiation pattern. The data presented in this paper clearly indicates polyimide materials are well suited to cover microstrip antenna circuits with minimal impact on performance.
Deepukumar Nair, Applications Development Manager
Research Triangle Park, NC

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic