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Overlay compensation of distorted bonded-wafers using advanced photolithography system infrared metrology
Keywords: Through-Silicon Alignment (TSA), Infrared Metrology, Bonded-Wafer
This paper examines the use of a Canon FPA-5510iV stepper to measure and compensate for distortion of wafer shot-grid layout experienced by bonded and thinned wafer stacks. Given the gross shot location and intrafield error in severely distorted wafers, advanced overlay compensation methods usually reserved for front-end-of-the-line processes must be applied. Canon will introduce results demonstrating the performance of the stepper Through-Silicon Alignment (TSA) System and E-AGA function that allows for shot-specific shift, magnification and rotation correction.
Doug Shelton, Product Marketing Manager
Canon USA
San Jose, CA
USA


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