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High-Reliability Component Attachment Process for <5m Placement Accuracy
Keywords: <5µm Placement Accuracy, High Reliability, Military & Aerospace
As complex microelectronic packaging designs and components mature, improved placement accuracy becomes increasingly more important. High-accuracy placement has been an ongoing theme in the commercial assembly arena for several years. For example, some phononic designs require better than 2m precision placement for optimum performance. Military and aerospace companies routinely evaluate higher precision requirements, although this has been traditionally accomplished using semi-automatic bonder equipment. A manual or semi-automatic process is adequate and often perceived as essential for prototyping; however, semi-automatic processes are not practical for higher volume production. Aside from the slower speed of semi-automatic equipment, application performance relies on how well the technician can target the die since these systems mainly require manual alignment. This paper presents a process solution for automating sub-5m component attach and is specific to organizations requiring high-reliability device packaging. The methods presented in this paper have been proven through real-world experiences related to the high-reliability microelectronics industry.
Donald J. Beck, General Manager, Palomar Technologies Assembly Services™
Palomar Technologies
Carlsbad, CA
USA


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