Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High-Reliability Component Attachment Process for <5µm Placement Accuracy|
|Keywords: <5Âµm Placement Accuracy, High Reliability, Military & Aerospace|
|As complex microelectronic packaging designs and components mature, improved placement accuracy becomes increasingly more important. High-accuracy placement has been an ongoing theme in the commercial assembly arena for several years. For example, some phononic designs require better than 2µm precision placement for optimum performance. Military and aerospace companies routinely evaluate higher precision requirements, although this has been traditionally accomplished using semi-automatic bonder equipment. A manual or semi-automatic process is adequate and often perceived as essential for prototyping; however, semi-automatic processes are not practical for higher volume production. Aside from the slower speed of semi-automatic equipment, application performance relies on how well the technician can target the die since these systems mainly require manual alignment. This paper presents a process solution for automating sub-5µm component attach and is specific to organizations requiring high-reliability device packaging. The methods presented in this paper have been proven through real-world experiences related to the high-reliability microelectronics industry.|
|Donald J. Beck, General Manager, Palomar Technologies Assembly Servicesâ„¢