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PoP package warpage contributors' characterization and impact analysis
Keywords: warpage , modeling, characterization
Package-on-package technology is widely adopted in application processor packaging for today's equipment with great mobility requirement, dominantly smart phones and tablets. One of the key issues in such technology is the warpage control. Due to the short life cycle of such package, usually one or two years, the development process cannot afford large scale, time consuming and complex DOE's to identify the optimized package parameters that will satisfy the package's warpage requirement. It is therefore in need of a theoretical model that could provide realistic predictions of warpage under the constraints of bill of materials, optimized guidance to DOE plans, and mitigation strategy based on limited warpage data measurement. This paper uses the classic theory of asymmetric layered composites to analyze under thermal effect how the PoP package warpage changes by varying the die size and thickness, substrate layer count, substrate core thickness and CTE, and mold compound thickness and CTE. Finite element analysis model and experimental data is also included.
Shengmin Wen,
Amkor Technology Inc
Chandler, AZ
USA


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