Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Wedge Bonding RF and Microwave Devices
Keywords: Wire Bonding, RF Microwave Bonding, Interconnects
Interconnecting RF and Microwave devices requires demanding capabilities that can only be provided by wedge bonding. Flat, extremely low loop shape, constant wire length and ribbon bonding are all normal capabilities of wedge bonders that cannot be produced by ball bonders. The flexibility and design of wedge bonding equipment enables all of these capabilities by designing the wire clamp so that both round and ribbon wire can be easily interchanged on the same bond head with only minor adjustments. The shape and functionality of the wedge, feeding the wire from behind and under the face of the tool naturally produces lower height loops than ball bonders. New software assists the process by making the programming of low, stress-free loops user friendly. The conduction of high frequency electrical signals occurs in the wire "skin" (the outer 0.5m of the wire cross-section). Ribbon wire, because it often has a width/ thickness ratio of 10:1 has a much larger surface area (skin) than round wire. It is often required for RF and microwave devices for this reason. Many high-speed devices require minimum height (flat) short loops of the same wire length to match inductances of signals for proper performance. New wedge bonder software has the capability of specifying either constant wire length or constant loop height. A constant loop length wire would vary height so that each wire in the group was produced with the same length of wire. A constant loop height wire would vary length, so that all wires in the group had the same height, even if their lengths varied. Enhanced tear routines also allow reverse bonding over raised structures (air bridges) on MEMS devices New wedge bonders have many enhanced features that improve productivity and enable today's product engineers to improve quality, enhance productivity and bond the most challenging packages with full confidence in their process.
Lee Levine, Distinguished Member of the Technical
Hesse & Knipps Inc
Fremont, , CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic