Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Process For Treating Woven Glass Cloth|
|Keywords: CAF, glass fiber, laminate|
|Woven fiberglass cloth is the most common reinforcement material used in printed circuit boards. The glass yarn is typically coated with sizing agents to facilitate fabrication of woven glass. The glass cloth is subsequently subjected to thermal processes to remove the sizing prior to deposition of a silane-based coupling agent designed to improve the interfacial adhesion between the glass filaments and the resin matrix. Residual glass sizing was found to deleteriously effect glass surface wetting leading to weak adhesion of the resin to the yarn resulting in a number of printed circuit board failure mechanisms such as delamination cracks, IR (internal resistance) and CAF (copper anodic filament) growth. A solvent-based cleaning process has been demonstrated to not only effectively remove the residual sizing, but also to retain the tensile strength of the woven glass cloth.|
|Dylan Boday, Advisory Scientist