Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Making New from Old
Keywords: embedding, packaging, 3D integration
In the past few years, embedding has emerged as a valid contender to traditional packaging technologies for specific applications. It uses PCB (Printed-Circuit Board) processes for 3D integration of active and passive elements to create SiPs (System in Package). Just like MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, and then were adapted to match the specific requirements, so does embedding build on decades-old techniques to create this new class of packages. Inherent advantages include: - Compatibility with traditional SMT processes, in particular with regards to pitch, - Production batch size, - Historical reliability and process data, - Thermal management, - Possibility to integrate EMI shielding, - CTE matching. This paper will present the challenges and opportunities of this packaging technology in terms of processes, performance and reliability. It will focus on the solution developed by AT&S called ECP (Embedded-Component Packaging). Whereas competition is integrating PCB processes to their semiconductor-packaging operations, AT&S is the only vendor building on its PCB tradition to enter the packaging industry, thereby presenting a view of the subject.
Nick Renaud-Bezot,
Leoben, Styria

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic