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Making New from Old
Keywords: embedding, packaging, 3D integration
In the past few years, embedding has emerged as a valid contender to traditional packaging technologies for specific applications. It uses PCB (Printed-Circuit Board) processes for 3D integration of active and passive elements to create SiPs (System in Package). Just like MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, and then were adapted to match the specific requirements, so does embedding build on decades-old techniques to create this new class of packages. Inherent advantages include: - Compatibility with traditional SMT processes, in particular with regards to pitch, - Production batch size, - Historical reliability and process data, - Thermal management, - Possibility to integrate EMI shielding, - CTE matching. This paper will present the challenges and opportunities of this packaging technology in terms of processes, performance and reliability. It will focus on the solution developed by AT&S called ECP (Embedded-Component Packaging). Whereas competition is integrating PCB processes to their semiconductor-packaging operations, AT&S is the only vendor building on its PCB tradition to enter the packaging industry, thereby presenting a view of the subject.
Nick Renaud-Bezot,
AT&S
Leoben, Styria
Austria


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