Abstract Preview

Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Silicon Interposer Enables Optical to Electrical Transceiver
Keywords: 2.5D/3D, Opto to Electro, Interposer
Silicon substrates containing plated vias and etched traces are becoming accepted as ultra-miniature circuit boards. Silicon is very versatile and capable of doing more than simply supporting vias and traces. One novel application is to add grooves and mirrors to enable the transmission and reception of optical signals. The grooves are formed using the same etching processes used to form the TSVs. The mirrors use similar metal deposition and plating as the TSV metal plating processes. Signal transmission speeds exceeding 14 GB/sec will be demonstrated along with the assembly material considerations.
Phil Marcoux, Consultant
Sunnyvale, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic