Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Enabling Rapid Yield Ramp using new defect inspection techniques|
|Keywords: Defectivity, TSV, Process Control|
|As the industry is getting their hands around processes critical to cost-effective and reliable TSV manufacturing, a key enabler is process control through inspection and metrology. In working with the industry, Rudolph has developed a suite of solutions that incorporate inspection, metrology and software enabling rapid yield ramp. The solution set apply all the way from via etch to CMP, RDL, micro-bumping and on to Chip on Wafer mount and post-saw. Within the TSV process, a challenging inspection is that of detecting defects after CMP and nail reveal. The bonded wafers are warped, there are no alignment fiducials and the resolution requirement is high. In this paper, we will discuss a specific solution designed to address the nail reveal defectivity issue.|
|Rajiv Roy, Vice president of business development and Director, back-end Marketing
Rudolph Technologies, Inc.