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IC Package optimization targeting multiple form factors
Keywords: Co-Design, IC Packaging , Optimization
The days of designing a chip without regard to its package or final system configuration are over. To be competitive in today's market, companies designing chips must be able to plan and optimize chip level I/O configurations and package pin-outs for multiple devices with varied form factors. For example, engineers at a systems company designing a new processor need the ability to plan and optimize their chip level I/O configuration and package pin-outs for a phone, a tablet and several other variations of these devices. Another example would be traditional semiconductor company that is targeting new and varied applications in the smart phone market. They must be able to plan and optimize their chip level I/O and package pin-outs taking into account the unique form factor limitations of multiple final devices from several different companies. This presentation outlines a new co-design methodology that allows design teams the ability to easily plan and optimize I/O and connectivity from a chip, through multiple packaging variables while targeting multiple different PCBs (form factors). Using this concurrent design methodology, engineering teams for the IC, the Package and the PCB can drive rule-based I/O level optimization and pin assignments from their respective domains while visualizing the impact across the complete system. This methodology also introduces the concept of "design evolution" by giving engineering teams the ability to leverage early feasibility and planning data directly through to the final production design. The result of implementing this methodology will be a chip that is optimized for each target form factor through an optimized package pin-out and substrate. This methodology will drive down the cost of the package and PCB through layer reduction and tighter control of the design process without impacting the cost of the chip.
John Park, Methodology Architect
Mentor Graphics
Longmont, CO
USA


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