Here is the abstract you requested from the IMAPS_2012 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Additive Manufacturing of Fine Lines and Embedded Electronics for use in Chip Packaging and Microelectronic Systems|
|Keywords: High Density Interconnects, Fine Lines, Additive Manufacturing|
|Additive manufacturing is the application of layer manufacturing techniques to fabricate microelectronic products. These techniques differentiate themselves from incumbent technologies in that they only add material to build the device and are an alternative to subtractive technologies such as lithography that globally coat layers and then etch-away unrequired materials. In this paper we discuss an additive technology that performs material evaporation through shadow masks. This process has shown significant potential for the fabrication of chip packaging, microelectronic devices and circuitry; specifically, high density interposers, fine conductor lines and embedded components such as capacitors, resistors, and transistors. It has shown itself to be compatible with a number of both rigid and flexible substrates and deposition materials. Examples of devices and lines that have been manufactured by this technique are shown and discussed as well as preliminary test data presented with experimentation shown with line / space resolution that has reached 15 / 30 microns and better.|
|Scott Lauer, VP Product Development
Advantech US, Inc