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Development of Printed Power Packaging for a High Voltage SiC Module
Keywords: Printed, Power, value
Due to rapidly developing post silicon power devices, in particular SiC and GaN, three primary parameters in power packaging: temperature, voltage and current, are much more difficult to manage. The SiC devices are being developed for high voltage (>15kV). The GaN devices will have extremely low internal resistance, operate at extreme current densities (>>10A/, and can account for <50% of the resistance in a power module. Both devices can operate at high temperatures (>300C) and >10-times frequency compared to Si. The traditional power electronics packaging approaches need augmentation or replacement. Most technologies used in packaging of power electronic systems, or more generally "Electronic Energy Systems," are ported from microelectronics. The recent development of printable 3D circuit techniques, e.g. jetting and dispensing, provide additional major approaches applicable to power packaging. Some printing techniques are already applied to solar cells and batteries. This paper characterizes the "printable electronics" technology(ies), quantifying near-term and long-term parametric values and explores three primary generalized applications to traditional power packaging. One new approach describes the use of dispensed dielectric pastes in high voltage power modules for electric-field profiling. Pastes, either polymer or thick-film, can be applied with dynamically varying dielectric constants that selectively warp the field to reduce high field gradients that might occur during high voltage transient switching. The selective warping allows tighter packing of components among other benefits. A second approach uses conductive polymers in several facets to either augment, in 3-D, existing metal interconnects or provide directly-defined magnetic structures. One aspect of this research is the densification of existing conductive polymers to increase electrical conductance. Such enhancement will also provide better thermal management, including planar thermal pathways to reduce heat density. Another more leading characterization is the recent incorporation of nano-materials for electrical and thermal improvement.
Douglas C Hopkins, Professor
NC State University
Raleigh, NC

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